SLK Series -Thick Film Sintering Furnace
It is mainly used for high temperature firing process for low load product such as thick film IC, electronic components, LTCC, thin film cell and etc.
Rapid heating up rate(only takes 45 minutes from room temperature to 850℃）。
Using hardened ceramic heating plate to get high cleanliness chamber and temperature uniformity. Combining with the design of air flow, the temperature uniformity can reach to ±2℃ in flat temperature zone.
Industrial computer control system, online ultrasonic cleaning system, Ω flexible temperature profile wire.
总长 Overall Length（mm）
可根据用户要求定制。Notes:Sinovo also manufactures custom designed furnaces.