Application:

It is mainly used for high temperature firing process for low load product such as thick film IC, electronic components, LTCC, thin film cell and etc.

Feature:

Rapid heating up rate(only takes 45 minutes from room temperature to 850℃）。

Using hardened ceramic heating plate to get high cleanliness chamber and temperature uniformity. Combining with the design of air flow, the temperature uniformity can reach to ±2℃ in flat temperature zone.

Option:

Industrial computer control system, online ultrasonic cleaning system, Ω flexible temperature profile wire.